The coming MediaTek Dimensity 9400 is already promising some interesting upgrades in comparison with its predecessor. These upgrades and improvements will be seen in the performance and AI capabilities of this coming processor. Also, MediaTek is planning to use the TSMC 3nm fabrication process for the production of this coming flagship processor.
In terms of performance, the already existing Dimensity 9300 is on top of its game as it stacks up well against the competition. This flagship processor launched last year and is currently in use on some flagship device entries making the headlines. However, there is room for improvement in this existing processor and the coming Dimensity 9400 is preparing to bring these improvements.
Not only is this coming chip going to use the TSMC 3nm fabrication process, but it’ll also bring the upgraded Cortex-X5. For its AI computing capabilities, this coming processor will feature an LPDDR5T memory, which will ensure seamless integration. Thanks to these coming chips, flagship smartphones will be able to make use of local AI features without reliance on the cloud.
Already, some flagship devices come with local AI capabilities built into the devices. But this feature is not yet widespread to all flagship devices available for purchase today. This processor will also bring an 18% performance improvement, a 32% reduction in power consumption, and a 60% increase in logic density.
The coming MediaTek Dimensity 9400 processor will be a worthy upgrade. While the available reports show this coming processor’s improvements in comparison with its predecessor, how will it stack up against the competition? With the likes of the coming Snapdragon 8 Gen 4 processor also preparing to launch in Q4 2024, the Dimensty 9400 will need to prove itself worthy.